Ecological changes in the semiconductor supply chain, research: packaging lead time is extended to 50 weeks

Semiconductor packaging lead times continue to lengthen, and IC design service consulting firm Sondrel pointed out that due to the change in the order of capacity reservations in the semiconductor supply chain, and the time it takes for new packaging capacity to be in place and personnel training, the packaging lead time has been extended to 50 weeks.

UK-based IC design services consultancy Sondrel has warned that although the semiconductor supply shortage appears to be easing, the package lead time has been extended to 50 weeks.

Sondrel pointed out that in the early days of the COVID-19 (coronavirus disease 2019) outbreak, packaging factories faced customer orders cut, but with the recovery of semiconductor production capacity, packaging factories tried their best to solve the large number of orders such as the tsunami, but established new production capacity. It takes time to train skilled operators.

According to Sondrel’s analysis, the order of production capacity reservations in the semiconductor supply chain has changed. In the past, it took about 12 weeks to complete the IC design and then hand it over to the wafer manufacturing. Factory ready. The current situation is that it takes at least 20 weeks to complete the packaging design and production capacity before the semiconductor design is completed to ensure that the wafer fabrication and packaging are completed together.

Sondrel pointed out that if new semiconductor manufacturing process patterns are not observed, the wafer production cycle will be delayed to about 40 weeks.

ASE Investment Control, a major packaging and testing company, previously pointed out that the semiconductor industry continues to expand capital expenditures, equipment delivery times continue to lengthen, and the supply of wafers, carrier boards, lead frames, etc. is still tight. However, according to customer information, semiconductor production capacity and supply chain constraints will continue beyond 2023.

Industry insiders and Japanese foreign legal persons said that last year, the production capacity of packaging factories increased by 10% to 20%, and packaging factories continued to open new production capacity this year. However, Japanese foreign legal persons pointed out that this year, the semiconductor packaging and testing foundries (OSAT) should pay attention to it. Whether the market supply and demand reverses, wafer inventory adjustment, changes in Chinese chip demand and other variables, the capital expenditure plan for this year will be adjusted in a timely manner.

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